Electronic device with liquid-resistant sim tray and audio module

ABSTRACT

An electronic device having several modifications designed to prevent liquid ingress into an opening (or openings) of the electronic device is disclosed. For example, the electronic device includes a SIM tray having a sealing element designed to provide a seal at an opening that receives the SIM tray. The sealing element may include a first section and a second section extending from the first section, with the first section designed to bend with respect to (and in some cases collapse onto) the second section. The electronic device may further include an audio module fitted with a sealing element. The sealing element may include extensions extending away from a main body of the sealing element, with some extension designed to engage the audio module, and other extensions designed to engage an audio module interface. The sealing element provides a seal against liquid ingress into the audio module.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of priority to U.S. ProvisionalApplication No. 62/383,982, filed on Sep. 6, 2016, and titled “WATERRESISTANT FEATURES OF A PORTABLE ELECTRONIC DEVICE,” the disclosure ofwhich is incorporated herein by reference in its entirety.

FIELD

The following description relates to an electronic device. Inparticular, the following description relates to a portable electronicdevice that includes modifications to a tray used to carry a subscriberidentification module (“SIM”) card, and also relates to an audio module.The tray and the audio module are each fitted with a sealing elementdesigned to provide a seal against liquid ingress, so that openings inthe electronic device (associated with the tray and the audio module)prevent or limit liquid ingress into the electronic device.

BACKGROUND

Portable electronic devices generally include one or more openings.These openings allow for features and enhancements for the portableelectronic device. For example, a portable electronic device can includean opening for a SIM tray. However, the opening leaves the portableelectronic device vulnerable to liquid exposure, and possible damage tothe portable electronic device.

Further, an additional opening can be used for an audio module. However,the same issue—liquid exposure—can also result from the opening. Evenwhen the audio module is sealed, the portable electronic device mayinclude other components used with the audio module. The interfacebetween the audio module and the other components ultimately results inthe potential for liquid ingress into the portable electronic device.

SUMMARY

In one aspect, an electronic device is described. The electronic devicemay include an enclosure that defines an internal volume. The electronicdevice may further include a through hole formed in the enclosure andhaving an internal surface. The through hole may be in communicationwith the internal volume. The electronic device may include a subscriberidentification module (SIM) tray that is movable with respect to theenclosure. The electronic device may include a sealing element having afirst section and a second section. The second section can be securedwith the SIM tray. In some embodiments, when the SIM tray is insertedinto the through hole the first section engages the internal surfacesuch that a liquid is prevented from entering the internal volume viathe through hole.

In another aspect, an electronic device is described. The electronicdevice may include an audio module that generates acoustical energy. Theaudio module may include a snout. The electronic device may furtherinclude an audio module interface that secures with the audio module.The electronic device may further include a sealing element that engagesthe audio module and the audio module interface. The sealing element mayinclude a first extension and a second extension. The first extensionmay engage the audio module interface and the second extension mayengage the snout. Also, the sealing element may form a seal thatprevents a liquid from entering between the audio module and the audiomodule interface.

In another aspect, an electronic device is described. The electronicdevice may include an enclosure that defines an internal volume. Theenclosure may include a through hole that opens to the internal volume.The electronic device may further include a button that generates acommand to an operational component in the internal volume. The buttonmay extend at least partially in the through hole. The electronic devicemay further include a sealing element secured with the button andengaging the enclosure at the through hole. The sealing element mayprovide a seal against a liquid at the through hole.

In another aspect, a method for forming an electronic device having anenclosure that includes an internal volume is described. The enclosuremay include a through hole that opens to the internal volume. The methodmay include providing a SIM tray that carries a SIM card. The SIM traycan be movable with respect to the enclosure. The method may furtherinclude positioning a sealing element onto the SIM tray. The sealingelement may include a first section and a second section. The secondsection may be secured with the tray. In some embodiments, in responseto the SIM tray being inserted into the through hole, the through holedeforms the first section relative to the second section and the sealingelement forms a seal from a liquid at the through hole.

Other systems, methods, features and advantages of the embodiments willbe, or will become, apparent to one of ordinary skill in the art uponexamination of the following figures and detailed description. It isintended that all such additional systems, methods, features andadvantages be included within this description and this summary, bewithin the scope of the embodiments, and be protected by the followingclaims.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1 illustrates a front isometric view of an embodiment of anelectronic device, in accordance with some described embodiments;

FIG. 2 illustrates a rear isometric view of the electronic device shownin FIG. 1;

FIG. 3 illustrates a cross sectional view of the electronic device shownin FIG. 2, taken along line A-A, showing the camera aligned with theopening of the enclosure;

FIG. 4 illustrates an exploded view of the electronic device shown inFIGS. 1 and 2, showing various components and features of the electronicdevice;

FIG. 5 illustrates an isometric view of the enclosure undergoing acoating operation;

FIG. 6 illustrates the enclosure shown in FIG. 5, subsequent to thecoating operation and removal of the mask;

FIG. 7 illustrates a cross sectional view of the enclosure shown in FIG.6, taken along line B-B, showing the first coating disposed along thefirst layer and the enclosure;

FIG. 8 illustrates an isometric view of an adhesive assembly thatsecures the frame with the enclosure, showing the adhesive assemblydivided into multiple sections;

FIG. 9 illustrates a partial plan view of the adhesive assembly (shownin FIG. 8) positioned on the enclosure, further showing the adhesiveassembly disposed on the enclosure and the first coating;

FIG. 10 illustrates a cross sectional view of the enclosure shown inFIG. 9, taken along line C-C, showing the adhesive parts positioned onthe enclosure and the first coating;

FIG. 11 illustrates a cross sectional view of the enclosure shown inFIG. 10, further showing the protective layer and the frame secured withthe enclosure via the adhesive assembly;

FIG. 12 illustrates an exploded view of a switch assembly that includesthe switch, as well as several additional components that assemble withthe switch;

FIG. 13 illustrates a cross sectional view of the switch and variouscomponents shown in FIG. 12, showing the switch and componentspositioned in the enclosure;

FIG. 14 illustrates an exploded view of the button and several sealingelements;

FIG. 15 illustrates a cross sectional view of the button and the sealingelements shown in FIG. 14, showing the components positioned in theenclosure;

FIG. 16 illustrates a cross sectional view of the enclosure, showing thefirst rail embedded in the frame and covered by the adhesive;

FIG. 17 illustrates an exploded view showing the vent and variouscomponents used with the vent;

FIG. 18 illustrates a cross sectional view of the vent shown in FIG. 17,showing the vent positioned in the enclosure;

FIG. 19 illustrates an isometric view of the first fastener and acoating disposed on the first fastener;

FIG. 20 illustrates a cross sectional view of the first fastener shownin FIG. 19, showing the first fastener inserted into the enclosure andsecured with the second rail;

FIG. 21 illustrates an isometric view of the dock;

FIG. 22 illustrates a cross sectional view of the dock shown in FIG. 21,showing the dock inserted into the enclosure;

FIG. 23 illustrates an isometric view of the speaker module andassociated components used with the speaker module;

FIG. 24 illustrates a cross sectional view of the speaker module shownin FIG. 23, taken along line D-D, showing liquid-resistant modificationsto the speaker module;

FIG. 25 illustrates a cross sectional view of the speaker module andassociated components disposed in the enclosure;

FIG. 26 illustrates an isometric view of the tray and the sealingelement used with the tray to limit or prevent liquid ingress;

FIG. 27 illustrates a cross sectional view of the tray and the sealingelement shown in FIG. 26, showing the tray and the sealing elementpartially positioned in an opening of the enclosure;

FIG. 28 illustrates a cross sectional view of the tray and the sealingelement shown in FIG. 27, showing the tray and the sealing elementpositioned in the enclosure;

FIG. 29 illustrates an isometric view of the audio module and associatedcomponents used with the audio module that are designed to limit orprevent liquid ingress;

FIG. 30 illustrates a cross sectional view of the audio module shown inFIG. 29, showing the sealing element disposed in the opening of theaudio module interface;

FIG. 31 illustrates a cross sectional view of the audio module shown inFIG. 30, further showing the audio module secured with the sealingelement;

FIG. 32 illustrates an exploded view of the circuit board, along withseveral elements used to provide an ingress barrier for the circuitboard;

FIG. 33 illustrates a cross sectional view of the circuit board shown inFIG. 32, further showing the first sealing element surrounding the firstconnector, and the first connector connected with a circuit connector;

FIG. 34 illustrates an isometric view of an alternate embodiment of anenclosure suitable for an electronic device, showing a receiving elementused to receive a fastener, in accordance with some describedembodiments;

FIG. 35 illustrates a flowchart showing a method for forming anelectronic device that prevents liquid ingress through an enclosure ofthe electronic device, in accordance with some described embodiments;

FIG. 36 illustrates a flowchart showing a method for forming anelectronic device having an enclosure, in accordance with some describedembodiments;

FIG. 37 illustrates a flowchart showing a method for forming anelectronic device having an enclosure defines an internal volume, inaccordance with some described embodiments;

FIG. 38 illustrates a flowchart showing a method for assembling anelectronic device that includes an enclosure that defines an internalvolume, in accordance with some described embodiments; and

FIG. 39 illustrates a flowchart showing a method for forming anelectronic device having an enclosure that includes an internal volume,in accordance with some described embodiments.

Those skilled in the art will appreciate and understand that, accordingto common practice, various features of the drawings discussed below arenot necessarily drawn to scale, and that dimensions of various featuresand elements of the drawings may be expanded or reduced to more clearlyillustrate the embodiments of the present invention described herein.

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following descriptions are not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments as defined by theappended claims.

In the following detailed description, references are made to theaccompanying drawings, which form a part of the description and in whichare shown, by way of illustration, specific embodiments in accordancewith the described embodiments. Although these embodiments are describedin sufficient detail to enable one skilled in the art to practice thedescribed embodiments, it is understood that these examples are notlimiting such that other embodiments may be used, and changes may bemade without departing from the spirit and scope of the describedembodiments.

The following disclosure relates to electronic devices that includeseveral modifications designed to prevent liquid ingress into theelectronic device. An electronic device described herein may includeseveral openings, or through holes, each of which allows functionalityof a component (of the electronic device) to enhance the overallperformance of the electronic device. Rather than reduce the number ofopenings, thereby reducing the number of features, the electronic device(and some of its components) may include one or more liquid-resistantfeatures located at or near the openings. The phrase “liquid-resistant”may apply to a material or material that is resistant to water-basedsolutions. The liquid-resistant features enable the electronic device toinclude the various components, while limiting or preventing liquid fromentering the openings. As a result, damage to the electronic device thatcan result from liquid ingress may be prevented.

The electronic device may include an enclosure formed from metal. Theenclosure may define an internal volume used as a housing for severalinternal components, such as a radio circuit, as a non-limiting example.In order to enable wireless communication by the radio circuit, theenclosure may include a channel (or channels) opening to the internalvolume. The channel may be covered or plugged by an insert-moldedmaterial in an internal region of the enclosure and a plastic moldedmaterial on an exterior region of the enclosure, with each materialallowing passage of radio frequency (“RF”) transmission. In order toprevent liquid ingress through the channel and through the interfaceregions of the molded materials, a coating may be applied along theinterior of the enclosure. The coating may cover the insert-moldedmaterial and seal the enclosure from liquid that may enter through thechannel. Also, the coating may include a material that allows passing ofRF transmission.

The enclosure may further include an opening for a component, such as aswitch used to control a function (or functions) of the electronicdevice. The switch may be part of an assembly that also includes aswitch body and a bracket. The switch body may include aliquid-resistant film. Further, the switch body may seal with thebracket by a sealing element, such as an O-ring or insert-moldedelement. Also, the bracket may seal with the enclosure at the opening(that receives the switch) by a sealing element.

Also, internal components of the electronic device may include amaterial (or materials) applied to liquid-sensitive components. Forexample, a circuit board may include integrated circuits covered by anencapsulating material that shields the integrated circuits from liquidswithout affecting the performance of the circuit board and itscomponents. Further, the circuit board may include connectors designedto electrically couple the circuit board with other circuit boardsand/or internal components. To shield the connectors, foam made from aliquid-resistant material may surround the connectors.

A “sealing element” as used in this detailed description may include acompliant or compressible material that is generally liquid-resistant.For example, a sealing element may include rubber or silicone. Thesealing element may include a pre-fabricated ring designed to fit arounda component. Alternatively, the sealing element may be molded over acomponent by a molding operation, such as insert molding. In thisregard, the sealing element may include liquid silicone rubber.

These and other embodiments are discussed below with reference to FIGS.1-39. However, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these Figures is forexplanatory purposes only and should not be construed as limiting.

FIG. 1 illustrates a front isometric view of an embodiment of anelectronic device 100, in accordance with some described embodiments. Insome embodiments, the electronic device 100 is a laptop computer device.In other embodiments, the electronic device 100 is a wearable electronicdevice designed to secure with an appendage (such as a wrist) of a userof the electronic device 100. In the embodiment shown in FIG. 1, theelectronic device 100 is a portable electronic device, such as a mobilewireless communication device that may take the form of, for example, asmartphone or a tablet computer device. Also, the electronic device 100may include liquid-resistant modifications that provide the electronicdevice 100 with a shield from ingress into the electronic device 100.This will be described below.

The electronic device 100 may include an enclosure 102 that defines aninternal volume that receives several internal components (not shown),such as a processor circuit, a memory circuit, an internal power supply,sensors, speaker modules, and a microphone, as non-limiting examples.The enclosure 102 may be formed from a metal, such as aluminum or analloy that includes aluminum. However, other materials are possible,such as glass, rigid plastic or ceramic. Also, when the enclosure 102 isformed from a metal, the enclosure 102 may undergo an anodizationprocess that includes immersing the enclosure 102 in an anodic bath withone or more acidic compounds. The anodization process is designed toprovide an aesthetic finish to the enclosure 102 as well as improve thestructural rigidity.

The electronic device 100 may further include a display assembly 104designed to present visual information, such as text, video, or stillimages, to a user of the electronic device 100. Further, the displayassembly 104 may include a touch-sensitive layer, including capacitivetouch-sensitive technology, designed to respond to a touch input to thedisplay assembly 104. In this regard, the display assembly 104 mayrespond to the touch input by changing the visual information presentedon the display assembly 104. The electronic device 100 may furtherinclude a protective layer 106 that covers the display assembly 104. Theprotective layer 106 may include a transparent material, such as glassor sapphire. Also, the protective layer 106 may include an opening 108.When the electronic device 100 is used for voice communication, theopening 108 may define an acoustical pathway for an audio module (notshown) to transmit acoustical energy out of the electronic device 100 byway of the opening 108.

The electronic device 100 may include external controls, or inputdevices, that provide an input or command to an operational component(such as a processor circuit) of the electronic device 100. For example,the electronic device 100 may include an input device, such as a switch110, electrically coupled to a processor circuit (not shown) in theelectronic device 100. The switch 110 may be actuated relative to theenclosure 102 in a direction toward or away from the protective layer106. The electronic device 100 may further include an additional inputdevice, such as a button 112, electrically coupled to a processorcircuit in the electronic device 100. The switch 110 may be actuatedrelative to the enclosure 102 in a direction toward the enclosure 102.In order to provide the switch 110 and the button 112, the enclosure 102may include a first sidewall 114 having openings, with an opening usedto receive the switch 110 and another opening used to receive the button112, as shown in FIG. 1.

The electronic device 100 may further require additional openings foradditional features of the electronic device 100. For example, theelectronic device 100 may include a second sidewall 116. The secondsidewall 116 may include openings 118 that allow airflow into and out ofthe electronic device 100. A vent (not shown), located in the electronicdevice 100, that includes an air-permeable, liquid-resistant material,may seal the openings 118. This will be shown and described below. Also,the electronic device 100 may include openings 122. A speaker module(not shown), located in the electronic device 100, may be modified toprevent liquid ingress entering the openings 122 from further ingressinto the electronic device 100. This will be shown and described below.Also, the electronic device 100 may include an opening 124 and a dock(not shown) aligned with the opening 124. The dock may be used toreceive a connector (not shown). In this manner, the electronic device100 may electrically couple with an external device (not shown), by wayof the dock, such that the electronic device 100 may send or receivedata, as well as receive electrical power to charge in internal powersupply (not shown), or battery, in the electronic device 100.

In order to secure the protective layer 106 with the enclosure 102, theelectronic device 100 may include fasteners, such as a first fastener126 and a second fastener 128, that pass through additional openings(not labeled) of the enclosure 102 and fasten into rails (not shown)that are secured with the protective layer 106. This will also be shownand described below.

FIG. 2 illustrates a rear isometric view of the electronic device 100shown in FIG. 1. As shown, the enclosure 102 may be partitioned intomultiple regions. For example, the enclosure 102 may include a firstportion 103 (denoting a top portion of the enclosure 102), a secondportion 105 (denoting a bottom portion of the enclosure 102), with thefirst portion 103 and the second portion 105 separated by a chassis 107,or base frame. In some instances, a cutting operation applied to theenclosure 102 separates a single body of metal into the first portion103, the second portion 105, and the chassis 107. In this regard, thefirst portion 103, the second portion 105, and the chassis 107 may beformed from the same material(s). In some embodiments (not shown), thefirst portion 103 and the second portion 105 remain at least partiallylinked with the chassis 107, subsequent to the cutting operation. In theembodiment shown in FIG. 2, the cutting operation severs the firstportion 103 and the second portion 105 from the chassis 107. Also, thefirst portion 103 and the second portion 105 may be used not only asprotective components, but may also define part of an antenna (ormultiple antennae) used by the electronic device 100. Further, thechassis 107 may be used not only as a protective component, but also asan electrical ground for internal components (not shown) that areelectrically coupled to the chassis 107.

The enclosure 102 may include a first part 132 that separates the firstportion 103 from the chassis 107, and a second part 134 that separatesthe second portion 105 from the chassis 107. In some embodiments, thefirst part 132 and the second part 134 are positioned in a first channel136 and a second channel (not labeled), respectively. The channels maydefine partial openings in the enclosure 102 that open to the internalvolume of the enclosure 102. In this regard, the channels may allow forradio frequency (“RF”) communication through the enclosure 102.Accordingly, the electronic device 100 may include radio circuits (notshown), such as a Bluetooth radio circuit, cellular network circuits,and an 802.11 (Wi-Fi) protocol radio circuit, that provide theelectronic device 100 with RF communication capabilities. Also, thefirst part 132 and the second part 134 may include an insert-moldedplastic. However, other RF-passive materials (that is, materials throughwhich RF transmission permeate or resonate) are possible. The first part132 and the second part 134 may be used to at least partially fill thechannels, with an additional material (not shown) disposed in theinternal volume and engaged with the aforementioned parts. The firstpart 132 and second part 134 may be co-planar, or flush, with respect tothe enclosure 102, and may enhance the appearance of the electronicdevice 100 by providing the enclosure 102 with a generally continuous orsmooth finish.

The electronic device 100 may further include a camera 138 designed tocapture an image external to the electronic device 100. Accordingly, theenclosure 102 may include an opening 142 that allows the camera 138 tocapture an image. Also, in order to retain some account informationrelated the user of the electronic device 100 and/or to authenticate theuser, a subscriber identification module (“SIM”) card (not shown) may bedisposed in the electronic device 100. In this regard, the electronicdevice 100 may include a tray 144 designed to carry the SIM card. Thetray 144 may eject from the electronic device 100 in order to insertand/or remove the SIM card.

Due in part to the various openings and channels described in FIGS. 1and 2, the electronic device 100 may include several desirable featuresfor a user. However, despite the openings and channels, the electronicdevice 100 may nonetheless include enhancements to provide aliquid-resistant device, which may prevent ingress into the electronicdevice 100, thereby preventing damage to one or more components of theelectronic device 100. In order for the electronic device 100 to includeliquid-resistant capabilities, the openings and channels should besufficiently sealed. This will be shown and described below.

FIG. 3 illustrates a cross sectional view of the electronic device 100shown in FIG. 2, taken along line A-A, showing the camera 138 alignedwith the opening 142 of the enclosure 102. Some parts are removed forpurposes of simplicity. As shown, the electronic device 100 includes acamera trim 152 that at least partially surrounds the camera 138. Thecamera trim 152 is designed to carry a protective layer 154 thatprovides a transparent cover for the camera 138. The protective layer154 may be secured with the camera trim 152 by an adhesive 156. In someembodiments, the adhesive 156 includes a heat-activated film. However,other adhesives are possible. The adhesive 156 may provide aliquid-resistant bond between the camera trim 152 and the protectivelayer 154.

Also, the enclosure 102 may include a groove 158 formed in the enclosure102 and extending around the opening 142. Also, as shown, the groove 158can open to the opening 142. The groove 158 is designed to receive asealing element 162 that engages the camera trim 152. The sealingelement 162 may include a compliant, liquid-resistant seal. In someembodiments, the sealing element 162 is formed from a thermoplasticelastomer. When engaged with both the enclosure 102 and the camera trim152, the sealing element 162 may provide a liquid-resistant barrierbetween the enclosure 102 and the camera trim 152, thereby preventingliquid from entering the electronic device 100 at a location between thecamera trim 152 and the enclosure 102. Also, as shown, the sealingelement 162 includes a chamfered region 164 designed to interface with achamfered region 166 of the camera trim 152 during insertion of thecamera trim 152 into the opening 142. In this regard, the aforementionedchamfered regions may facilitate insertion of the camera trim 152. Also,although not required, the enclosure 102 may further include a pocket168. When compressed by the camera trim 152 and the enclosure 102, thesealing element 162 may extend into the pocket 168. Accordingly, thepocket 168 may be used as a relief section such that camera trim 152 canbe inserted into the opening 142 without the sealing element 162providing an excessive force against the camera trim 152. In otherwords, by receiving a portion of the sealing element 162, the pocket 168may prevent the camera trim 152 from unwanted positioning in theenclosure 102.

FIG. 4 illustrates an exploded view of the electronic device 100 shownin FIGS. 1 and 2, showing various components and features of theelectronic device 100. For purposes of illustration, the displayassembly 104 and the protective layer 106 (shown in FIG. 1) are removed.As shown, the enclosure 102 may define an internal volume 180 designedto receive several internal components. Various features and componentsof the electronic device 100 previously described may include one ormore liquid-resistant modifications designed to prevent or limit liquidingress into the electronic device 100. The features and componentsdescribed in FIG. 4 will be further described in this detaileddescription.

The switch 110 may include a switch body 202 that receives the switch110. The switch body 202 may secure with a bracket 204 secured by asealing element (not shown). Also, the switch body 202 may include afilm (not shown) that provides a liquid-resistant barrier for the switchbody 202. This will be shown below. Also, the bracket 204 may include afirst sealing element 206 that engages an opening 172 of the enclosure102 when the switch 110 is installed in the electronic device 100. Inthis manner, the switch 110 may be included in the electronic device100, while the opening 172 is sealed to prevent liquid ingress into theelectronic device 100 at the opening 172. As shown, the button 112 mayinclude protrusions designed to enter openings 174 in the enclosure 102.The protrusions may include sealing elements that provide aliquid-resistant barrier at the openings 174.

The electronic device 100 may further include a frame 240 designed tocarry the protective layer 106 (shown in FIG. 1). The frame 240 mayinclude an adhesive 242 used to adhesively secure the aforementionedprotective layer with the frame 240. The adhesive 242 may be applied ina tortuous configuration so as to avoid certain components (such asfasteners, connectors, buttons, etc.). Also, although the adhesive 242is shown as continuously applied to the frame 240, the adhesive 242 mayinclude breaks or discontinuities.

The electronic device 100 may further include an audio module 260designed to convert audio signals into acoustical energy in the form ofaudible sound. The audio module 260 may include a sealing element 264that secures the audio module 260 with an audio module interface 280that extends through an opening 244 of the frame 240, allowing the audiomodule interface 280 to adhesively secure with the protective layer 106(shown in FIG. 1). The sealing element 264 may include extensionsdesigned to deform when engaged with the audio module 260 as well as theaudio module interface 280, thereby providing a liquid-resistant sealbetween the audio module 260 and the audio module interface 280. Theextensions will be shown and described in detail below.

The frame 240 may include several rails at least partially embedded inthe frame 240, with the rails used to secure the frame 240 with theenclosure 102. For example, the frame 240 may include a first rail 246that secures in a first receptacle 176 of the enclosure 102. The firstrail 246 may be embedded in the frame 240, and also covered by theadhesive 242. In this manner, the adhesive 242 provides an ingressbarrier in a location corresponding to the first rail 246. This will beshown below. Also, the frame 240 may include a second rail 248 thatincludes a first opening 252 and a second opening 254. When the frame240 is secured with the enclosure 102, the first fastener 126 and thesecond fastener 128 extend through the first opening 252 and the secondopening 254, respectively, with each fastener secured with an opening ofthe second rail 248. Also, an adhesive layer (shown later) may be usedto adhesively secure the frame 240 with the enclosure 102. Although notshown, the frame 240 may include a third rail having a size and shapesimilar to that of the first rail 246, and designed to secure in asecond receptacle 178 of the enclosure 102.

In order to allow airflow into and out of the electronic device 100, theelectronic device 100 may include a vent 302. The vent 302 may include amembrane 304 that is air-permeable, but liquid resistant. In thismanner, when the vent 302 secured in the enclosure 102 and against theopenings 118, air may enter or exit the enclosure 102 via the openings118 and the vent 302, while the membrane 304 prevents liquid passageinto the electronic device 100. Also, the vent 302 may include a bracket306 and a sealing element 308 secured over the bracket 306. The sealingelement 308 may be molded onto the bracket 306 by an insert moldingoperation. The sealing element 308 may include silicone, or anothercompliant, liquid-resistant material. Also, the sealing element 308 mayengage the enclosure 102 to provide an ingress barrier between thebracket 306 and the enclosure 102. This will be shown below.

In order to seal the openings that receive the first fastener 126 andthe second fastener 128, the first fastener 126 and the second fastener128 may be coated with polymeric material that is sprayed or otherwisedeposited thereon. The polymeric material may include polyurethane, as anon-limiting example. As shown, the first fastener 126 includes acoating (not labeled) and the second fastener 128 includes a coating(not labeled). The aforementioned coatings may compress or conform tothe openings that receive the first fastener 126 and the second fastener128, thereby sealing those openings from liquid ingress.

The electronic device 100 may further include a dock assembly 500 thataligns with the opening 124 when installed in the internal volume 180.The dock assembly 500 may include several terminals designed toelectrically couple the electronic device 100 with an external device(not shown). As a result of the terminals, the dock assembly 500 mayinclude several openings. However, the dock assembly 500 may be sealedsuch that liquid ingress entering the dock assembly 500 is prevented orlimited from further ingress into the internal volume 180. This will beshown below.

The electronic device 100 may further include a speaker module 602 thataligns with the openings 122 when installed in the internal volume 180.The speaker module 602 may include a speaker opening 604 that allowsacoustical energy generated by the speaker module 602 to exit thespeaker module 602. Despite the speaker opening 604, the speaker module602 may include several internal modifications such that any liquidentering the speaker opening 604 (by way of the openings 122) does notcause damage to the speaker module 602. Also, the speaker module 602 mayinclude a bracket 606 secured with the speaker module 602 by a sealingelement (shown and described below).

As previously described, the tray 144 is designed to carry the SIM card,and may eject from the electronic device 100 for insertion and/orremoval of the SIM card. The tray 144 may include a sealing element 146designed to fold or collapse when compressed between the tray 144 andthe enclosure 102. This will be shown below.

In addition to the electronic device 100 having several liquid-resistantmodifications to exterior regions, the electronic device 100 may includeadditional modifications to centrally located components. For example,the electronic device 100 may include an internal power supply 702 and acircuit board 704 electrically coupled with the internal power supply702. An encapsulating material may cover the circuit board 704, as wellas several components (shown as dotted lines) on the circuit board 704,thereby forming a liquid-ingress barrier that prevents corrosion andshort-circuiting, due to liquid, of the aforementioned components.Alternatively, the circuit board 704 may be covered by a tape or spray.

Also, the electronic device 100 may include main circuit board 802, or“motherboard,” that is in communication with several electricalcomponents in the electronic device 100. The main circuit board 802,along with components (shown as dotted lines) on the main circuit board802, may be encapsulated with an encapsulating material 804. Theencapsulating material 804 may include a hydrophobic coating designedresist water that would otherwise contact the main circuit board 802 andits components. The encapsulating material 804 may be applied by a vapordeposition operation. Also, the main circuit board 802 may includeconnectors used to electrically couple the main circuit board 802 withother circuit boards (not shown) or other components. For example, themain circuit board 802 may include a first connector 806 uncovered bythe encapsulating material 804, and surround by a first sealing element818 formed from a liquid-resistant material, such as a closed-cell foam.This will be further shown and described below.

FIG. 5 illustrates an isometric view of the enclosure 102 undergoing acoating operation. As shown, the enclosure 102 may further include afirst layer 182 and a second layer 184 disposed in the internal volume180, and positioned in locations corresponding to the first part 132 andthe second part 134 (shown in FIG. 2), respectively. The first layer 182and the second layer 184 may provide a rigid layer in locationsgenerally void of the enclosure materials, such as between the firstportion 103 and the chassis 107, and between the second portion 105 andthe chassis 107. In order to apply the first layer 182 and the secondlayer 184, a molding operation (including an insert molding operation)to the enclosure 102 may be used. Accordingly, the first layer 182 andthe second layer 184 may be referred to as a first insert molded layerand a second insert molded layer, respectively. The first layer 182 andthe second layer 184 may include a rigid, non-metal material(s) thatprovides structural support to the enclosure 102, particularly inlocations of the channels that receive the first part 132 and the secondpart 134. Moreover, the first layer 182 and the second layer 184 mayinclude RF-permissive materials that permit transmission of RFcommunication. In other words, the first part 132 and the first layer182 may form a first RF window for an electronic device (such as theelectronic device 100, shown in FIG. 1), and the second part 134 and thesecond layer 184 may form a second RF window for the electronic device.

The coating tool 190 may apply a spray coating 192 that includes apolymeric material, such as polyurethane, as a non-limiting example.However, other materials, such as UV-cured glues or other sealingmaterials may be used. The spray coating 192 is designed to cover thefirst layer 182 and the second layer 184, particularly in locationscorresponding to the first part 132 and the second part 134 (shown inFIG. 2). In this manner, the spray coating 192 may seal the enclosure102 and prevent liquid ingress entering the channels (not shown) locatedin areas corresponding to the first part 132 and the second part 134.Once the spray coating 192 is applied to the enclosure 102, the spraycoating 192 is cured by a heating operation. Also, in some instances,the enclosure 102 includes a mask 194 used to prevent the spray coating192 from contacting certain predetermined locations of the enclosure102, such as locations in which some internal components are secured orfastened with the enclosure 102. The mask 194 may be removed subsequentto the coating operation. While a particular shape of the mask 194 isshown, other shapes are possible.

In some instances, air may become trapped at an interface between two ormore parts. As the air passes through the spray coating 192, the air maycause bubbling. In order to reduce bubbling of the spray coating 192,the spray coating 192 may include a thinner material, or other solvent,to thin the spray coating 192. Also, the heating/curing operations maybe altered to promote movement of any bubbles out of the spray coating192 once the spray coating is applied to the enclosure 102. For example,the heat applied to the spray coating 192 during a curing operationcoupled with decreased heating time may, along with the thinner, reducethe bubbling of the spray coating 192. In addition, a vacuum can be usedto remove the air and/or pull the spray coating 192.

FIG. 6 illustrates the enclosure 102 shown in FIG. 5, subsequent to thecoating operation and removal of the mask 194. Subsequent to the removalof the mask 194, FIG. 6 shows a first coating 186 and a second coating188 covering the first layer 182 and the second layer 184, respectively.The first coating 186 and the second coating 188 remain to provide aningress barrier to liquids that may pass through the aforementionedchannels that receive the first part 132 and the second part 134 (shownin FIG. 2). Also, when the mask 194 is removed the enclosure 102, thechassis 107 includes a region or regions in which the first coating 186and the second coating 188 are not present. The region(s) of theenclosure 102 that does not include the first coating 186 or the secondcoating 188 can be used not only as a platform to which internalcomponents are secured, but also as an electrically conductive region(as the enclosure 102 can be formed from a metal) that provides anelectrical grounding pathway.

Also, while a spraying operation is shown and described in FIGS. 5 and6, additional processes may be used to apply a coating. For example, thefirst coating 186 and the second coating 188 may be applied by manualmeans, including brushing or applying a coating material to a smallsurface. These manual means may be complementary to the sprayingoperation, in order to ensure coating material is applied to cornerregions or other complex, non-planar geometries. Also, in order to alterthe amount of spray coating 192 (shown in FIG. 5) dispensed and/or theamount of pressure applied to the spray coating 192, the coating tool190 may include a nozzle such that the spray coating 192 may bedispensed through the nozzle.

FIG. 7 illustrates a cross sectional view of the enclosure 102 shown inFIG. 6, taken along line B-B, showing the first coating 186 disposedalong the chassis 107, the first layer 182 and the first portion 103. Asshown, the first coating 186 substantially covers the first layer 182such that any liquid ingress that passing through the first part 132 andthe first layer 182 may be limited or prevented from passing into theinternal volume 180. Also, the first coating 186 may substantially covera platform 109 that defines a receiving surface for the frame 240 (shownin FIG. 4). The platform 109 may be formed in part by the first portion103 and the first layer 182. Also, the first portion 103 and the firstlayer 182 may interface each other such that the first coating 186 maycover the first portion 103 and the first layer 182 along a horizontalplane (parallel, or at least substantially parallel, to the chassis107). In this manner, any forces (such as gravitational forces) actingon the first coating 186 do not cause the first coating 186 to “drain”or fall onto the chassis 107. In other words, the horizontal planepromotes the first coating 186 remaining on the platform 109. Althoughnot shown, in other locations, the second portion 105 may combine withthe second layer 184 to form an additional part of the platform 109 in asimilar manner as that shown in FIG. 7.

Also, as shown in FIG. 7, the chassis 107 may include an extension 111used as a levee, or embankment, that prevents the first layer 182 fromcreeping or otherwise extending to unwanted locations of the chassis107. Also, the extension 111 may provide an additional horizontalinterface, similar to above, between the first layer 182 and the chassis107, thereby promoting a stagnation or fixation of the first coating186. Also, it should be noted that the material used for the firstcoating 186 includes RF-permissive materials so as to provide little, ifany, interference with RF communication.

Additional sealing means may be provided to the enclosure 102 thatcombines with the coatings. For example, FIG. 8 illustrates an isometricview of an adhesive assembly 330 that secures the frame 240 with theenclosure 102 (both of which are not shown), showing the adhesiveassembly 330 divided into multiple sections. For example, the adhesiveassembly 330 may include a first adhesive part 332, a second adhesivepart 334, a third adhesive part 336, and a fourth adhesive part 338.Dividing the adhesive assembly 330 into multiple sections may facilitateapplying the adhesive assembly 330 to the enclosure 102. This may reducethe manufacturing time, and associated costs, of assembling the adhesiveassembly 330 with the enclosure 102 (shown in FIG. 4). Also, while adiscrete number of sections are shown, a different number of sections ispossible. Also, each adhesive part is designed to mate with an adjacentsection. As shown, each adhesive part may include “V” configuration. Forexample, the first adhesive part 332 includes a protruding section 342that extends into a recessed section 344 of the second adhesive part334. The protruding section 342 may include a protruding V-shapedsection, and the recessed section 344 may include a recessed V-shapedsection having a shape corresponding to that of the protruding section342. Although the adhesive parts may be separated when applied to theenclosure 102 (shown in FIG. 4), when the frame 240 is secured with theenclosure 102, the compressive forces between the frame 240 (shown inFIG. 4) and the enclosure 102 may cause the adhesive parts to expand andengage other adhesive parts at their respective V-sections. This will beshown and described below.

FIG. 9 illustrates a partial plan view of the adhesive assembly 330positioned on the enclosure 102, further showing the adhesive assembly330 disposed on the enclosure 102 and the first coating 186. In someinstances, the adhesive assembly 330 is also disposed on the first layer182 (shown in FIG. 5). As shown, the first adhesive part 332 and thesecond adhesive part 334 may at least partially cover the first coating186 such that the adhesive parts combine with the first coating 186 toprovide an ingress barrier. Although not shown, the remaining adhesiveparts may at least partially cover the second coating 188 (shown in FIG.6) in a similar manner.

FIG. 10 illustrates a cross sectional view of the enclosure 102 shown inFIG. 9, taken along line C-C, showing the adhesive assembly 330positioned on the enclosure 102 and the first coating 186. As shown, thefirst adhesive part 332 is separated from the second adhesive part 334.However, the adhesive parts may compress, causing the adhesive partsbond with one another. For example, FIG. 11 illustrates a crosssectional view of the enclosure 102 shown in FIG. 10, further showingthe protective layer 106 and the frame 240 secured with the enclosure102 via the adhesive assembly 330. As shown, the compression forcesprovided by the frame 240 and/or the enclosure 102 cause the adhesiveparts of the adhesive assembly 330 to expand and engage one another. Inthis regard, the adhesive assembly 330 may combine with the firstcoating 186 (and also the second coating 188, not shown) to furtherprovide an ingress barrier against liquids that may attempt to enterbetween the frame 240 and the enclosure 102.

Also, in some instances, prior to securing the protective layer 106 andthe frame 240 with the enclosure 102, the coatings may undergo a cuttingoperation to reduce the space occupied by the coating. For example, asshown in FIG. 11, the first coating 186 may be cut along a corner region196 such that the amount of material defining the first coating 186 isreduced at the corner region 196. The cutting operation may include amilling operation or a computer numeric control (“CNC”) cuttingoperation.

FIG. 12 illustrates an exploded view of a switch assembly that includesthe switch 110, as well as several additional components that assemblewith the switch 110. The switch 110 may be connected to a switch body202 that allows the switch 110 to actuate relative to the switch body202. The switch body 202 may include a film 210 disposed on the switchbody 202. The film 210 may include a liquid-resistant material. In someembodiments, the film 210 includes a nylon film. Also, as shown, thefirst sealing element 206 may be positioned on an outer perimeter of thebracket 204. The first sealing element 206 may include a compliant,liquid-resist material that conforms in response to compressive forces.The switch body 202 may secure with the bracket 204 by a second sealingelement 212, which may include a complaint seal or gasket. Also, thebracket 204 may include an opening 214 that allows a circuit (not shown)to electrically couple with the switch 110.

FIG. 13 illustrates a cross sectional view of the switch and variouscomponents shown in FIG. 12, showing the switch 110 and componentspositioned in the enclosure 102. As shown, when the switch 110 andassociated components are positioned in the opening 172, the firstsealing element 206 seals with the enclosure 102 to prevent liquidingress entering the opening 172 and passing into the internal volume180. Further, the second sealing element 212 may prevent liquid ingresspassing through the opening 172 from contacting an electrical connectionpoint between the switch body 202 and a circuit 216 electrically coupledto the switch body 202. Also, the film 210 further protects the switchbody 202 from liquid ingress. Accordingly, the enclosure 102 may besealed at the opening 172 from liquid ingress.

FIG. 14 illustrates an exploded view of the button 112 and severalsealing elements. As shown, the button 112 may include a firstprotrusion 224 that receives a first sealing element 226 and a secondprotrusion 228 that receives a second sealing element 230. The firstsealing element 226 and the second sealing element 230 may include acompliant, liquid-resist material that conforms in response tocompressive forces. Also, the first sealing element 226 and the secondsealing element 230 may stretch to fit onto grooved regions of the firstprotrusion 224 and the second protrusion 228, respectively. For example,the first protrusion 224 includes a first grooved region 236 for thefirst sealing element 226, and the second protrusion 228 includes asecond grooved region 238 for the second sealing element 230.

FIG. 15 illustrates a cross sectional view of the button 112 and thesealing elements shown in FIG. 14, showing the components positioned inthe enclosure 102. When positioned in the openings 174, the sealingelements may engage the enclosure 102 to form a liquid barrier betweenthe button 112 and the enclosure 102 to prevent liquid from entering theinternal volume 180. For example, as shown in the enlarged view, thefirst sealing element 226 may compress against the first protrusion 224and the enclosure 102. The second sealing element 230 (labeled in FIG.14) may be positioned and compressed in a manner similar to that of thefirst sealing element 226. Accordingly, the enclosure 102 may be sealedfrom liquid ingress at the openings 174. Also, when the button 112 isdepressed, the first protrusion 224 slides through the opening of theenclosure 102 and engages a switch mechanism 232 (which may include atactile switch) to close the switch mechanism 232, thereby sending anelectrical signal along a circuit 234 electrically coupled to the switchmechanism 232. However, the first sealing element 226 moves inconjunction with the first protrusion 224 and remains positioned againstan internal surface of one of the openings 174 to provide the liquidingress barrier. It should also be noted that the second protrusion 228moves in a manner similar to that of the first protrusion 224 to engagethe switch mechanism 232, and the second sealing element 230 moves inconjunction with the second protrusion 228 while remaining positionedagainst an internal surface of the remaining one of the openings 174 toprovide the liquid ingress barrier.

FIG. 16 illustrates a cross sectional view of the enclosure 102, showingthe first rail 246 embedded in the frame 240 and covered by the adhesive242. As shown, the adhesive 242 covers the first rail 246 in a mannersuch that any liquid ingress entering between the frame 240 and theprotective layer 106 may be prevented from further liquid ingress, duein part to the adhesive 242. In particular, the adhesive 242 may preventadvancement of liquid ingress in locations associated with the firstrail 246.

FIG. 17 illustrates an exploded view showing the vent 302 and variouscomponents used with the vent 302. For example, the membrane 304 mayinclude an air-permeable, water-resistant material that allows air, butnot liquid, to pass through the vent 302. The membrane 304 may besecured with the bracket 306 by an adhesive 310. However, other methodsmay be used to secure the membrane 304 with the bracket 306. Forexample, the membrane 304 may be ultrasonically welded to the bracket306. Alternatively, the membrane 304 may be molded into the bracket 306by an insert molding operation. Also, the vent 302 may further include asealing element 308 secured with an outer perimeter of the bracket 306.The sealing element 308 may include a compliant, liquid-resist materialthat conforms in response to compressive forces. Also, the sealingelement 308 may be molded to the bracket 306 by an insert moldingoperation. However, other methods described for securing the membrane304 with the bracket 306 may be used to secure the sealing element 308with the bracket 306. Also, as shown, the bracket 306 may include anopening 312 to allow air to pass through the bracket 306 via the opening312.

FIG. 18 illustrates a cross sectional view of the vent 302 shown in FIG.17, showing the vent 302 positioned in the enclosure 102. As shown inthe enlarged view, the sealing element 308 may compress against thebracket 306 and the enclosure 102 to form an ingress barrier thatprevents liquid that enters the openings 118 (both of which are shown inFIG. 4) from further passing into the internal volume 180. In thismanner, the membrane 304 is positioned at the openings 118 to allow air,but not liquid, into or out of the internal volume 180. This may allowthe electronic device 100 (shown in FIG. 1) to equilibrate and adjust toa change in external pressure.

Also, the vent 302 may undergo an assembly test to ensure the membrane304 is properly secured with the bracket 306. In particular, theassembly test may determine whether the adhesive 310 properly seals themembrane 304 with the bracket 306, and/or whether the sealing element308 properly seals the bracket 306 with the enclosure 102. For example,a polyethylene terephthalate (“PET”) material (not shown) may engage themembrane 304 and seal the openings 118. Then a negative pressure, orvacuum, may be applied within the internal volume 180, and the air leakrate around the adhesive 310 and sealing element 308 is determined andcompared with a threshold air leak rate to ensure a desired seal isachieved.

FIG. 19 illustrates an isometric view of the first fastener 126 and asealing element 402 disposed on the first fastener 126. As shown, thefirst fastener 126 may include a head 404 and a shaft 406. The shaft 406can receive a tool (not shown) to rotationally drive the shaft 406 intoan object, such as the second rail 248 (shown in FIG. 4). Also, theshaft 406 may provide a threaded engagement with the object. The sealingelement 402 may include a polymeric material, such as polyurethane,deposited on the shaft 406 and under the head 404. Alternatively, thesealing element 402 may be replaced by an O-ring. The sealing element402 may include a compliant, liquid-resistant material that compressesin response to some forces. Also, although the first fastener 126 isshown, the second fastener 128 (shown in FIG. 4) may include any featureor features previously described for the first fastener 126.

FIG. 20 illustrates a cross sectional view of the first fastener 126shown in FIG. 19, showing the first fastener 126 inserted into theenclosure 102 and secured with the second rail 248. As shown, when thefirst fastener 126 is inserted into an opening 412 of the enclosure 102and in threaded engagement with the second rail 248, the sealing element402 may compress between the enclosure 102 and the first fastener 126,thereby forming an ingress barrier at the opening 412. It will beappreciated that the second fastener 128 (shown in FIG. 4) may achievesimilar results when inserted into the enclosure 102.

FIG. 21 illustrates an isometric view of the dock assembly 500. The dockassembly 500 may include a dock body 502 having an opening 504, orcavity, designed to receive a connector (not shown). The dock assembly500 may further include terminals 506 electrically coupled with one ormore circuit boards (previously described). The terminals 506 aredesigned to electrically couple the connector with one or more of thecircuit boards. The dock assembly 500 may further include a protrusion508 designed to mate and engage with the connector, when the connectoris in the opening 504, to provide a frictional force that maintains theconnector within the opening 504 and maintains the connector inelectrical communication with the terminals 506. The dock assembly 500may further include a first sealing element 510 that seals an opening520 (formed in the dock body 502) that receives the protrusion 508. Insome embodiments, the first sealing element 510 includes an adhesive.However, other types of materials are possible, such as a compliantmaterial previously described for a sealing element. As shown, the firstsealing element 510 is located on a wall that includes the opening 520through which the protrusion 508 passes. However, the first sealingelement 510 may extend to an additional wall. This will be discussedbelow. Also, the dock assembly 500 may include a moisture detectionsensor 512 that detects moisture that enters the opening 504.

In order for the dock assembly 500 to prevent liquid ingress into anelectronic device (that includes the dock assembly 500), the variousfeatures of the dock assembly 500 require several openings that aresealed. For example, FIG. 22 illustrates a cross sectional view of thedock assembly 500 shown in FIG. 21, showing the dock assembly 500inserted into the enclosure 102. The opening 504 of the dock assembly500 aligns with the opening 124 such that a connector (not shown) mayextend through the opening 124 of the enclosure 102 and into the dockassembly 500. The terminals 506 may electrically couple with a circuit514 that passes through a rear opening of the dock assembly 500. Asshown in the enlarged view, the dock body 502 may include a secondsealing element 516 that seals the rear opening to prevent liquidentering the dock body 502 from further passing through the rear openingand into the internal volume 180. The second sealing element 516 mayinclude any material previously described for the first sealing element510. Also, the first sealing element 510 may extend across a rearportion, or a second wall, of the dock assembly 500 to provide furtheringress protection. For example, the moisture detection sensor 512(shown in FIG. 21) may include an electronic moisture detection circuitelectrically coupled with the circuit 514. In this instance, themoisture detection sensor 512 requires an opening (not shown) along therear portion in order to electrically couple with the circuit 514. Thefirst sealing element 510 may cover at least a portion of the opening toprovide ingress protection at the moisture detection sensor 512. Also,the dock assembly 500 may include a plate 518 secured with the dockassembly 500. The plate 518 may include a plastic plate secured with thedock assembly 500 by a laser welding operation, as a non-limitingexample. The plate 518 facilitates covering the openings of the dockassembly 500, and may combine with the second sealing element 516 toprovide the dock assembly 500 with a liquid-resistant barrier.

FIG. 23 illustrates an isometric view of the speaker module 602 andassociated components used with the speaker module 602. As shown, whenthe speaker module 602 is positioned in the electronic device 100 (shownin FIG. 4), the speaker opening 604 aligns with an opening of theelectronic device, thereby allowing acoustical energy generated fromspeaker module 602 to exit the speaker opening 604 and the electronicdevice opening. In order to provide a liquid-resistant seal, the speakermodule 602 may include a sealing element 608 designed to secure betweena portion of the speaker module 602 and the bracket 606. The sealingelement 608 may include a compliant, liquid-resist material thatconforms in response to compressive forces. Also, although not shown, anadditional sealing element may surround the bracket 606 such that theadditional sealing element engages the bracket and the enclosure 102(shown in FIG. 4) when the speaker module 602 is inserted into to theelectronic device.

FIG. 24 illustrates a cross sectional view of the speaker module 602shown in FIG. 23, taken along line D-D, showing liquid-resistantmodifications to the speaker module 602. For example, the speaker module602 may include an acoustic volume that includes a front volume 612 anda back volume 614. The front volume 612 and the back volume 614 areseparated at least partially by a membrane 616, with the front volume612 opening to the speaker opening 604 and the back volume 614 fullyenclosed by multiple components. The speaker module 602 may furtherinclude a membrane 616 designed to vibrate at various frequencies toproduce acoustical energy. Also, the membrane 616 may include aliquid-resistant membrane such that the membrane 616 is not damaged whenexposed to liquid. In this regard, the membrane 616 may includesilicone, as a non-limiting example. The speaker module 602 may furtherinclude an internal bracket 618 that receives the membrane 616. Theinternal bracket 618 may include a liquid-resistant material, such asplastic. The internal bracket 618 may combine with the membrane 616 todefine a partition in the speaker module 602 that separates the frontvolume 612 from the back volume 614, in which the front volume 612 mayreceive liquid through the speaker opening 604 without causing damage tothe speaker module 602 as the sensitive components (not shown) may bepositioned within the back volume 614. Further, in order to providepressure relief to the back volume 614, the internal bracket 618 mayinclude an air vent 622 that includes an air-permeable, liquid resistantmaterial designed to let air flow into and out of the back volume 614.

FIG. 25 illustrates a cross sectional view of the speaker module 602 andassociated components disposed in the enclosure 102. As shown, thespeaker module 602 is positioned in the enclosure 102 and aligned withthe openings 122 (both of which are shown in FIG. 4). Also, a meshmaterial 626 may cover the openings 122 and provide an aesthetic finish.The bracket 606 may secure with the speaker module 602 by an adhesive624 that include a liquid-resistant adhesive. Also, the sealing element608 is positioned between the speaker module 602 and the bracket 606 toform an ingress barrier between the speaker module 602 and the bracket606. In this manner, the speaker module 602 is positioned in theenclosure 102 such that any liquid entering the openings 122 may extendinto the front volume 612 but not the back volume 614. Also, any airentering the openings 122 may extend into both the front volume 612 andthe back volume 614, with the latter using the air vent (not labeled,shown in FIG. 24) to receive air. Accordingly, the speaker module 602may provide acoustical energy without promoting liquid ingressthroughout an electronic device.

FIG. 26 illustrates an isometric view of the tray 144 and the sealingelement 146 used with tray 144 to limit or prevent liquid ingress. Asshown, the tray 144 may include a head portion 352 and a body portion354 extending from the head portion 352. The head portion 352 mayinclude an opening 356 designed to receive a tool (not shown) such thatwhen the tray 144 is in the electronic device 100 (shown in FIG. 4), thetool can actuate an ejection apparatus (not shown) that causes the tray144 to eject from the electronic device. Further, when the tray 144 isinserted into the electronic device, the head portion 352 may beco-planar, or flush, with respect to a portion of the enclosure 102(shown in FIG. 2). The body portion 354 is designed to receive and carrya SIM card (not shown). Further, the body portion 354 may include arecessed portion 360 designed to receive the sealing element 146.

The sealing element 146 may include a compliant, liquid-resistantmaterial such as silicone, as a non-limiting example. As shown in FIG.26, the sealing element 146 may include a first section 358 and a secondsection 362. Further, the sealing element 146 may include an opening 364that allows the tray 144 to be inserted through the sealing element 146via the opening 364. The opening 364 allows the sealing element 146 tobe formed from a single piece material, and accordingly, the sealingelement 146 may be referred to as a single piece sealing element.Further, when the sealing element 146 is secured to the tray 144, thesecond section 362 may be secured with the tray 144 at the recessedportion 360. The first section 358 may bend or compress, in response toa force, causing the first section 358 to bend and/or deform relative tothe second section 362. Further, in some instances, the first section358 may collapse onto the second section 362. This will be shown below.

FIG. 27 illustrates a cross sectional view of the tray 144 and thesealing element 146 shown in FIG. 26, showing the tray 144 and thesealing element 146 partially positioned in an opening 370, or throughhole, of the enclosure 102. As shown in FIG. 27, the sealing element 146is not under any compressive force and is generally undisturbed.Further, with no forces acting on the sealing element 146, the firstsection 358 is perpendicular, or at least substantially perpendicular,with respect to the second section 362.

The opening 370 is designed to receive not only the tray 144, but alsothe sealing element 146. The opening 370 may include an internal surface372 designed to engage the sealing element 146, and in particular, thefirst section 358. When the tray 144 is fully inserted into the opening370 (shown below), at least a portion of the sealing element 146 engagesand deforms. In this regard, the opening 370 may include a notch 374positioned in the opening 370 such that when the tray 144 slides intothe opening 370, the first section 358 will engage the notch 374,causing the first section 358 to bend or deform (relative to the secondsection 362). In addition to serving as a contact point of the sealingelement 146, the notch 374 may provide a stop for the tray 144. Thiswill be shown below.

FIG. 28 illustrates a cross sectional view of the tray 144 and thesealing element 146 shown in FIG. 27, showing the tray 144 and thesealing element 146 positioned in the enclosure 102. The tray 144 may be“fully inserted” into the enclosure 102 when a surface of the headportion 352 is co-planar, or flush, with respect to a surface of theenclosure 102, as shown in FIG. 28. Further, the 144 may be fullyinserted when a tray housing 376 receives the tray 144, as shown in FIG.28. As shown, when the tray 144 is fully inserted within the opening 370(labeled above) of the enclosure 102, the sealing element 146 bends. Forexample, as shown in the enlarged view, the first section 358 bendsrelative to the second section 362. Further, in some instances, thefirst section 358 may bend sufficiently enough to collapse onto andengage the second section 362. However, the first section 358 remainscircumferentially engaged with the internal surface 372 of the opening370 (both labeled in FIG. 27). As a result, when the tray 144 isinserted in the enclosure 102, as shown in FIG. 28, the opening 370 issealed from liquid ingress by the sealing element 146. Also, in additionto providing a seal against a liquid (or liquids), the sealing element146 may also center the tray 144, in multiple dimensions, with respectto the tray housing 376.

FIG. 29 illustrates an isometric view of the audio module 260 andassociated components used with the audio module 260 that are designedto limit or prevent liquid ingress. The audio module 260 may generateacoustical energy. In this regard, the audio module 260 may be used as aspeaker that emits acoustical energy through a snout 262.

In order to provide an ingress barrier, the sealing element 264, shownas a partial cross section, may be fitted onto the snout 262. Thesealing element 264 may include a compliant, liquid-resistant materialthat deforms in response to compressive forces. Further, the sealingelement 264 may include several extensions, or flaps, designed to bend.As shown in the enlarged view, the sealing element 264 may include afirst interior extension 266 and a second interior extension 268. Thefirst interior extension 266 and the second interior extension 268 maybend or deform in response to engaging the snout 262. Also, when thesealing element 264 is fitted onto the snout 262, the first interiorextension 266 and the second interior extension 268 are designed tocompress against the snout 262 and provide a liquid-resistant sealbetween the sealing element 264 and the audio module 260 (at a locationaround the snout 262).

Further, an audio module interface 280 can be used to interface with anadditional component, such as the opening 108 of the protective layer106 (shown in FIG. 1). The audio module interface 280 may adhesivelysecure with the protective layer 106 around the opening 108, therebyforming a liquid-resistant seal. Also, the audio module interface 280may include an opening 282 to receive the sealing element 264 and thesnout 262. This will be shown below. Also, the sealing element 264 mayfurther include a first exterior extension 276 and a second exteriorextension 278. The first exterior extension 276 and the second exteriorextension 278 may bend or deform in response to the sealing element 264being positioned in the opening 282.

FIG. 30 illustrates a cross sectional view of the audio module 260 shownin FIG. 29, showing the sealing element 264 disposed in the opening 282of the audio module interface 280. As shown, when the sealing element264 is in the opening 282, the first exterior extension 276 and thesecond exterior extension 278 bend against the audio module interface280 along the circumference of the opening 282. This bending action maycompress the aforementioned extensions and enhance the seal between theaudio module interface 280 and the sealing element 264.

FIG. 31 illustrates a cross sectional view of the audio module 260 shownin FIG. 30, further showing the audio module 260 secured with thesealing element 264. As shown, when the snout 262 is positioned in thesealing element 264, the first interior extension 266 and the secondinterior extension 268 bend against the snout 262. This may enhance theseal between the audio module 260 and the sealing element 264.Accordingly, the sealing element 264 may provide a liquid-resistant sealbetween the audio module 260 and the audio module interface 280, and theaudio module interface 280 may secure with the protective layer 106(shown in FIG. 1) in a manner that prevents liquid passing through theopening 108 (shown in FIG. 1) from further extending around the sealingelement 264.

FIG. 32 illustrates an exploded view of the main circuit board 802,along with several elements used to provide an ingress barrier for themain circuit board 802. As shown, an encapsulating material 804 may beapplied to the circuit board. The encapsulating material 804 may beapplied by a deposition procession, including vapor deposition, in orderto reduce the overall space occupied by the encapsulating material 804.Also, the encapsulating material 804 may include a hydrophobic materialdesigned to resist some liquids. In this manner, the encapsulatingmaterial 804 may block water, for example, that would otherwise engagethe main circuit board 802. The encapsulating material 804 may coverinternal components, such as a first internal component 812, a secondinternal component 814, and a third internal component 816. In thisregard, the first internal component 812, the second internal component814, and the third internal component 816 are protected against liquidexposure, which is particularly useful when any of the aforementionedinternal components includes an integrated circuit or other operationalcomponent susceptible to damage from water.

While the encapsulating material 804 may cover the main circuit board802 and its internal components, the encapsulating material 804 may notcover the connectors. For example, the main circuit board 802 mayinclude a first connector 806 and a second connector 808, both of whichmay be used to electrically couple the main circuit board 802 withanother circuit board (not shown) or another electrical component (notshown). As shown, the encapsulating material 804 includes openings inlocations corresponding to the first connector 806 and the secondconnector 808. In order to shield the first connector 806 and the secondconnector 808, the first connector 806 and the second connector 808 maybe surrounded by a first sealing element 818 and a second sealingelement 822, respectively. In some embodiments, each of the firstsealing element 818 and the second sealing element 822 includes aclosed-cell foam. However, in some embodiments, each of the firstsealing element 818 and the second sealing element 822 includes anopen-cell foam. The first sealing element 818 and the second sealingelement 822 may combine with connectors (not shown) to seal the firstconnector 806 and the second connector 808, respectively. This will beshown below.

Also, in the event that liquid enters an electronic device, adetermination can be made whether the main circuit board 802 is exposedto the liquid. In this regard, liquid contact indicators may be appliedto the encapsulating material 804 (subsequent to the encapsulatingmaterial 804 deposited on the main circuit board 802). For instance, afirst liquid contact indicator 824 and a second liquid contact indicator826 are applied to the encapsulating material 804. Both the first liquidcontact indicator 824 and the second liquid contact indicator 826 aredesigned to change their appearance (change in color, for example) toprovide a visual indication that the first liquid contact indicator 824and the second liquid contact indicator 826 have been exposed to liquid.

FIG. 33 illustrates a cross sectional view of the main circuit board 802shown in FIG. 32, further showing the first sealing element 818surrounding the first connector 806, and the first connector 806connected with a circuit connector 836 that is coupled with a circuit840, which may include a flexible circuit. As shown, the circuitconnector 836 may surround the first connector 806 and combine with thefirst sealing element 818 to provide an ingress barrier for the firstconnector 806.

As discussed above, an enclosure of an electronic device may undergo ananodization process. However, the anodization process may alter theenclosure such that the outer perimeter, or exterior, is no longerelectrically conductive. In instances when the enclosure 102 (shown inFIG. 4) is used in part as an electrical ground, the enclosure 102 mayno longer provide the electrical ground. However, the outer perimetermay undergo a laser ablation operation to remove an anodization layer,thereby exposing an electrically conductive portion of the enclosure.The laser ablation operation may be used along receiving points andscrew points, each designed to receive a component, such as a fastener,thereby allowing the receiving points and screw points to provide anelectrically conductive path.

However, in order to prevent the laser ablation operation from removingthe insert molded layers and/or the liquid resistant coating, thereceiving points may be modified. For example, FIG. 34 illustrates anisometric view of an alternate embodiment of an enclosure 902 suitablefor an electronic device, showing a receiving element 904 used toreceive a fastener (not shown), in accordance with some describedembodiments. The enclosure 902 may include any feature or featurespreviously described for an enclosure. As shown in the enlarged view,the receiving element 904 may include an opening 906 designed to matewith a fastener or another component (not shown). The opening 906 mayundergo a laser ablation operation to remove an anodization layer toexpose an electrically conductive portion of the enclosure 902. In thismanner, when the fastener or component is positioned in the opening 906,the fastener or component may be electrically coupled to the enclosure902.

As shown, a layer 982, similar to the first layer 182 (shown in FIGS. 5and 6) surrounds the receiving element 904. Also, the enclosure 902 mayfurther include a coating layer (not shown) designed to prevent liquidingress into the enclosure 902, similar to a manner previouslydescribed. In order to prevent the layer 982 and any coating layer fromburning off, or otherwise being removed, during the laser ablationoperation, the receiving element 904 may include a radial thickness 908extending from the opening 906 to an edge of the receiving element 904.The radial thickness 908 provides additional space between the layer 982and the opening 906. In this manner, during the laser ablationoperation, the layer 982 (and any coating applied to the layer 982) isnot removed by the laser ablation.

FIG. 35 illustrates a flowchart 1000 showing a method for forming anelectronic device that prevents liquid ingress through an enclosure ofthe electronic device, in accordance with some described embodiments.The enclosure may be formed from a metal and may include a channel thatopens to an internal volume of the electronic device, with the internalvolume defined by the enclosure.

In step 1002, a mask is used to mask, or cover, an infernal internalvolume of the enclosure. The mask may include a removable mask. In thismanner, when the mask is removed, any material applied to the mask isalso removed. Further, the mask may allow the enclosure to retainelectrically conductive portions.

In step 1004, a coating is applied to the enclosure at the internalvolume. The coating may provide a seal against the liquid ingresspassing through the channel. The coating may include a liquid-resistantmaterial, such as polyurethane. Also, the coating may be applied by oneor more techniques, including spraying and painting, as non-limitingexamples.

In step 1006, after applying the coating, the mask is removed. Theportion of the coating that is applied to the mask is also removed withthe mask, while the portion uncovered by the mask remains on theenclosure at the internal volume. The portion in which the coating doesnot cover the enclosure, which may include a chassis of the enclosure,can be used as an electrical grounding pathway of the enclosure. In thisregard, any component electrically connected to the enclosure can beelectrically grounded. This may allow for the removal of static chargeon the component.

FIG. 36 illustrates a flowchart 1100 showing a method for forming anelectronic device having an enclosure, in accordance with some describedembodiments. The enclosure may include a through hole. In step 1102, aswitch is positioned at least partially in the through hole. The switchmay be used as an input device to control a function (or functions) ofthe electronic device, such as a volume adjustment (e.g., muting).

In step 1104, the switch is secured with a switch body. The switch bodyis designed to carry or hold the switch, while also allowing the switchto move/actuate relative to the switch body. Also, in some instances,the switch body is coated by a film design to provide the switch bodywith ingress protection. Also, the switch body may electrically couplewith a circuit that relays control signals generated by the switch.

In step 1106, the switch body is secured with a bracket. The bracket mayinclude a sealing element that engages the enclosure at the through holeto prevent liquid ingress from entering the enclosure at the throughhole. The sealing element may include a compliant material that conformsto the dimensions of the enclosure, and in particular, the dimensions ofthe through hole.

FIG. 37 illustrates a flowchart 1200 showing a method for forming anelectronic device having an enclosure defines an internal volume, inaccordance with some described embodiments. The enclosure may include athrough hole that opens to the internal volume. In step 1202, a dock ispositioned in the internal volume. The dock is designed to receive andelectrically couple to a connector that can supply data and/orelectrical power to the electronic device. The dock may include a firstopening that is aligned with the through hole such that the firstopening may receive the connector. Also, the dock may further include asecond opening.

In step 1204, a terminal is provided at the second opening. The terminalis configured to electrically couple with the connector when theconnector is inserted into the first opening. Accordingly, the terminalmay include an electrically conductive material, such as a metal. Also,the terminal may be electrically coupled to a circuit inside theelectronic device. In this manner, the circuit can carry electricalsignals, in the form of data or electrical power, throughout theelectronic device.

In step 1206, the terminal is secured with a sealing element. Thesealing element is designed to cover the second opening and prevent aliquid from entering the internal volume via the second opening. In someinstances, the sealing element includes an adhesive. In this manner, thesealing element not only provides a seal but also adhesively secures theterminal with the second opening.

FIG. 38 illustrates a flowchart 1300 showing a method for assembling anelectronic device that includes an enclosure that defines an internalvolume, in accordance with some described embodiments. The enclosure mayinclude a through hole that opens to the internal volume. In step 1302,a speaker housing is disposed in the internal volume. The speakerhousing may include a speaker opening that is aligned with the throughhole. Also, with the exception of the speaker opening, the speakerhousing may be free of additional openings, or may include an opening(s)covered by an airtight seal, such that the speaker housing defines anacoustic volume (including a front and back volume) that is maintainedseparately from air inside the internal volume.

In step 1304, a bracket is positioned around a portion of speakerhousing. For example, the bracket may at least partially surround aportion of the speaker housing associated with the speaker opening,thereby providing additional support to the speaker housing along thespeaker module. Also, the bracket may adhesively secure with theenclosure at or near the through hole. The adhesive used to secure thebracket to the enclosure may include a liquid-resistant adhesive.

In step 1306, a sealing element seals the bracket against the enclosureat the through hole. The sealing element may be positioned between thebracket and the enclosure, and may also engage the bracket and theenclosure. In this regard, the speaker housing is sealed from air in theinternal volume. Further, the speaker housing is positioned and designedto receive or emit air from an external environment outside theelectronic device. Also, a speaker module (that includes the speakerhousing) can emit acoustic energy from the speaker opening and thethrough hole. In this regard, the speaker module may include a membraneacoustically driven to generate the acoustical energy.

FIG. 39 illustrates a flowchart 1400 showing a method for forming anelectronic device having an enclosure that includes an internal volume,in accordance with some described embodiments. The enclosure may includea through hole that opens to the internal volume. In step 1402, a trayis provided. The tray may be suitable for carrying a SIM card. In thisregard, the tray may be referred to as a SIM tray.

In step 1404, the tray receives a sealing element. The sealing elementextends around the tray. In this manner, when the tray is inserted intothe through hole, the sealing element bends against the enclosure at thethrough hole, thereby forming a seal at the through hole. The sealingelement may include a first section and a second section connected tothe first section. When the tray is inserted into the through hole, thefirst section may bend or collapse onto, or in a direction toward, thesecond section. Further, the first section may remain engaged with theenclosure such that the sealing element provides a seal or shieldagainst liquid ingress at the through hole.

The various aspects, embodiments, implementations or features of thedescribed embodiments can be used separately or in any combination.Various aspects of the described embodiments can be implemented bysoftware, hardware or a combination of hardware and software. Thedescribed embodiments can also be embodied as computer readable code ona computer readable medium for controlling manufacturing operations oras computer readable code on a computer readable medium for controllinga manufacturing line. The computer readable medium is any data storagedevice that can store data which can thereafter be read by a computersystem. Examples of the computer readable medium include read-onlymemory, random-access memory, CD-ROMs, HDDs, DVDs, magnetic tape, andoptical data storage devices. The computer readable medium can also bedistributed over network-coupled computer systems so that the computerreadable code is stored and executed in a distributed fashion.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not targeted to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

1. An electronic device, comprising: an enclosure that defines aninternal volume; a through hole formed in the enclosure and having aninternal surface, the through hole in communication with the internalvolume; a subscriber identification module (SIM) tray that is movablewith respect to the enclosure; and a sealing element having a firstsection and a second section and an opening, the second section beingsecured with the SIM tray when the SIM tray is positioned in theopening, wherein when the SIM tray is inserted into the through hole thefirst section engages the internal surface such that a liquid isprevented from entering the internal volume via the through hole.
 2. Theelectronic device of claim 1, wherein when the SIM tray is inserted intothe through hole, the first section collapses onto the second section.3. The electronic device of claim 1, wherein the enclosure comprises anotch that is located in the through hole, and wherein when the SIM trayis inserted into the through hole, the first section is bent due toengagement with the notch.
 4. The electronic device of claim 1, whereinthe SIM tray comprises: a head portion that is co-planar with respect tothe enclosure when the tray is fully inserted into the enclosure; a bodyportion extending from the head portion and capable of receive a SIMcard; and a recessed portion between the body portion and the headportion, wherein the recessed portion receives the sealing element. 5.The electronic device of claim 4, wherein the second section ispositioned at least partially in the recessed portion.
 6. The electronicdevice of claim 1, wherein the enclosure includes a size and shape toreceive both the SIM tray and the sealing element.
 7. (canceled)
 8. Theelectronic device of claim 1, wherein the sealing element comprises acompliant PU coating.
 9. An electronic device, comprising: an audiomodule that generates acoustical energy, the audio module comprising asnout; an audio module interface that secures with the audio module; anda sealing element that engages the audio module and the audio moduleinterface, the sealing element comprising a first extension and a secondextension, the first extension engaging the audio module interface andthe second extension engaging the snout, the sealing element forming aseal that prevents a liquid from entering between the audio module andthe audio module interface.
 10. The electronic device of claim 9,wherein: the sealing element comprises an opening, and the secondextension is positioned within the opening.
 11. The electronic device ofclaim 10, wherein the first extension surrounds an exterior portion ofthe sealing element.
 12. The electronic device of claim 9, wherein whenthe first extension bends against the audio module interface, andwherein the second extension bends against the snout.
 13. The electronicdevice of claim 9, further comprising: a display assembly; and aprotective layer that covers the display assembly, the protective layercomprising an opening aligned with the audio module interface.
 14. Theelectronic device of claim 9, wherein in the first extension extends ina first direction, and wherein the second extension extends in a seconddirection opposite the first direction.
 15. The electronic device ofclaim 9, wherein the audio module interface includes an opening that atleast partially receives both the sealing element and the snout.
 16. Theelectronic device of claim 9, wherein the sealing element comprises:multiple extensions engaging the audio module interface; and multipleextensions engaging the snout.
 17. An electronic device, comprising: anenclosure that includes a bottom wall and sidewalls that combine withthe bottom wall to define an internal volume, the sidewalls including asidewall having a through hole that opens to the internal volume; abutton that generates a command to an operational component in theinternal volume, the button extending at least partially in the throughhole; a sealing element secured with the button and engaging theenclosure, thereby forming a seal from a liquid at an interface betweenthe sidewall and the button.
 18. The electronic device of claim 17,wherein the button comprises a protrusion that extends at leastpartially in the through hole.
 19. The electronic device of claim 18,wherein the sealing element is positioned on the protrusion.
 20. Theelectronic device of claim 18, wherein the protrusion comprises agrooved region that receives the sealing element.
 21. The electronicdevice of claim 18, further comprising a switch mechanism, wherein: theenclosure comprises a second through hole, the button comprises a firstend that includes the protrusion, the button further comprises a secondend opposite the first end, the second end including a second protrusionextending through the second through hole and having a second sealingelement positioned on the second protrusion, the second sealing elementprovides a second seal against the liquid at the second through hole,and the protrusion and the second protrusion combine to actuate theswitch mechanism when the button is depressed.
 22. The electronic deviceof claim 21, wherein the sealing element and the second sealing elementremain engaged with the through hole and the second through hole duringactuation of the button.
 23. The electronic device of claim 21, whereinwhen the button is actuated: the sealing element moves in conjunctionwith the protrusion, and the second sealing element moves in conjunctionwith the second protrusion.
 24. A method for forming an electronicdevice having an enclosure that includes an internal volume, theenclosure having a through hole that opens to the internal volume, themethod comprising: providing a SIM tray that carries a SIM card, the SIMtray movable with respect to the enclosure; and positioning a sealingelement onto the SIM tray, the sealing element having a first sectionand a second section, the second section being secured with the tray,wherein in response to the SIM tray being inserted into the throughhole, the through hole deforms the first section relative to the secondsection and the sealing element forms a seal from a liquid at thethrough hole, wherein the sealing element comprises a ring that includesan opening such that the SIM tray passes through the ring at theopening.
 25. The method of claim 24, further comprising: forming arecessed region in the SIM tray; and fitting the sealing element ontothe SIM tray at the recessed region.
 26. The method of claim 25, fittingthe second section onto the recessed region.
 27. The method of claim 26,wherein the first section is perpendicular with respect to the secondsection.
 28. The method of claim 24, wherein receiving the sealingelement comprises receiving a compliant PU material that forms thesealing element.
 29. (canceled)
 30. The method of claim 24, wherein thefirst section collapses onto the second section when the SIM tray isinserted into the through hole.
 31. The electronic device of claim 1,further comprising: a display assembly; a frame that carries the displayassembly, the frame coupled with the enclosure; and a second sealingelement that prevents a contaminant from entering a location between theframe and the enclosure.
 32. The electronic device of claim 1, furthercomprising: a switch; audio modules; speaker modules; a fastener; a portcapable of receiving a electrical connector; and a circuit board.